焊锡膏
Solder Paste
永安锡膏是用先进超声波雾化工艺自制的低含氧量真圆焊锡粉沫和基于日本先进焊接技术加以自主研发改良的助焊膏配制而成，整个生产均为真空或氮气环境中完成的。具有较高的抗耐塌陷性及良好的印刷性等，适合于细间距印刷，且在印刷后，均可保持长时间的粘著性。
永安锡膏是用先进超声波雾化工艺自制的低含氧量真圆焊锡粉沫和基于日本先进焊接技术加以自主研发改良的助焊膏配制而成，整个生产均为真空或氮气环境中完成的。具有较高的抗耐塌陷性及良好的印刷性等，适合于细间距印刷，且在印刷后，均可保持长时间的粘著性。
锡膏选用指南：
A Guide to the Selection of Solder Paste
常用焊锡合金：
Commonly Used Solder Alloy
| 合 金 成 份 Content of Alloy | 熔 点℃ Melting Point ℃ | 锡 条 Solder Bar | 锡 线 Solder Wire | 锡 粉 Solder Powder | 锡 膏 Solder Paste | 焊粉 Welding Powder |
|---|---|---|---|---|---|---|
| 无铅合金 Non-Lead Alloy |
|
|
| |||
| Sn99.95 | 232 | √ | √ | |||
| Sn-0.7Cu | 227 | √ | √ | √ | √ | √ |
| Sn-0.3Ag0.7Cu | 217~227 | √ | √ | √ | √ | √ |
| Sn-3.0Ag0.5Cu | 217 | √ | √ | √ | √ | √ |
| Sn-3.8Ag0.7Cu | 217~218 | √ | √ | √ | √ | √ |
| Sn-3.9Ag0.6Cu | 217~218 | √ | √ | √ | √ | √ |
| Sn-4.0Ag0.5Cu | 217~218 | √ | √ | √ | √ | √ |
| Sn-3.0Ag | 221 | √ | √ | |||
| Sn-3.5Ag | 221 | √ | √ | √ | √ | √ |
| Sn-0.3Sb0.7Cu | 227~228 | √ | √ | √ | √ | √ |
| Sn-5Sb | 235 | √ | √ | √ | √ | √ |
| Sn-Cu-Ni | 227 | √ | √ | √ | √ | √ |
| Sn-Cu-Ni-Ce | 227 | √ | √ | √ | √ | √ |
| Sn-Ag3.0Cu0.5-Ce | 217 | √ | √ | √ | √ | √ |
| Sn-58Bi | 138 | √ | √ | √ | ||
| Sn-Ag-Bi | 160~220 | √ | √ | √ | ||
| Sn-8Zn-3Bi | 199 | √ | √ | √ | ||
| 有铅合金 Lead alloy | ||||||
| Sn-37Pb | 183 | √ | √ | √ | √ | √ |
| Sn-40Pb | 183~190 | √ | √ | √ | ||
| Sn-43Pb14Bi | 144~163 | √ | √ | √ | ||
| Sn-36Pb2Ag | 179 | √ | √ | √ | ||
| Sn-36.6Pb0.4Ag | 183 | √ | √ | √ | ||
| Sn-90Pb | 268-302 | √ | √ | √ | √ | √ |
* 我公司还备有其它成份焊锡供客户选择，详情请向我公司咨询。
* Our company also boasts solders of other contents for the option by clients. For details, please contact us for inquiry.
