UV膜
UV Tape
适用于晶圆片和基片的切割 Dicing of Wafer and Substrate
适用于晶圆片和基片的切割 Dicing of Wafer and Substrate
UV 划片膜
Wafer划片、减薄膜
UV Tape — FINESET
1、Summary:
FINESET UV Tape has adhesion as ordinary adhesive tape, but once UV-light is exposed on, it reduces the adhesion and can be removed easily. This tape’s backing is made from non-halogen type material, and is expansible
2、Structure:
3、Feature :
Non-halogen backing material (Polyolefin) is used.High pressure mercury lamp or black light can be used as light source.
4、Application: Dicing of Wafer and Substrate