UV膜

UV Tape
适用于晶圆片和基片的切割 Dicing of Wafer and Substrate

UV 划片膜

UV划片膜1



Wafer划片、减薄膜

Wafer划片、减薄膜1


UV Tape — FINESET

1、Summary:

FINESET UV Tape has adhesion as ordinary adhesive tape, but once UV-light is exposed on, it reduces the adhesion and can be removed easily. This tape’s backing is made from non-halogen type material, and is expansible

2、Structure:

结构

3、Feature :

Non-halogen backing material (Polyolefin) is used.High pressure mercury lamp or black light can be used as light source.

4、Application: Dicing of Wafer and Substrate


半导体专业设备
无尘室耗材
仪表仪器和检测设备